Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.13, was identified after 6500 thermal cycles from -40AdC to 125AdC. Although a tAg, Cu13Sn plate is located near the ... Spalling may be a problem for applications with long design life requirements, This phenomenon is more common in ... tCourtesy of Nokia Corp.1 Cracking in a SAC flip-chip solder joint after 1000 thermal.

Title:Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author: Karl J. Puttlitz, Kathleen A. Stalter
Publisher:CRC Press - 2004-02-27

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